3D Heterogeneous Integration Development Engineer (Semiconductors) - Micross Components

Summary:      

This position will support the Micross 3D Heterogeneous Integration program areas, including:

• Development of semiconductor advanced packaging processes and technologies

• 2.5/3D integration:  TSV processing, wafer thinning & handle wafer processes, thermal compression bonding, etc.
• 3D microstructure fabrication, including monolithic fabrication on device wafers
• Wafer-level packaging & interconnects: bumps, Cu pillars, & redistribution

Primary responsibilities of this member of the engineering staff are to support Program Managers and technology development projects in the form of day-to-day project management to ensure customer deliverables and internal development project deliverables are successful and remain on schedule.  The position responsibilities include process development, building process flows & lot travelers, lot management & engineering support, as well as providing budgetary input on bids/proposals, and technical support for Program Managers on large proposals.  Duties may include development of photolithographic processing, wet processing, dry etching, thin film deposition, electroplating, and die assembly processes.  The position may also require performing mask design & layout, electrical testing, and other forms of material & process characterization. The successful candidate will have a strong background in back-end-of-the-line (BEOL) semiconductor processing (e.g. MEMS or other post-CMOS processing).  Experience in advanced packaging and/or 3D integration processes is desired.

Essential Duties & Responsibilities:

• Development engineers have most of the project engineering responsibility and visibility for day-to-day deliverable schedules.
• May include solving high level engineering problems independently or with help from Program Managers, or other Development Engineers
• May be asked to write papers, give presentations, support or prepare proposals, or contribute to quotes
• Participate in or lead customer meetings, and in some cases become the point of contact for customers
• Communicate daily processing needs or deliverable schedules to the Program Managers and/or Director of Operations
• Ensures adherence to their specific customer schedules and quality standards

Other Duties & Responsibilities:

• Comply with all safety policies, practices and procedures.
• Comply with all quality and ITAR policies, practices and procedures.
• Build meaningful and productive relationships with internal business partners.
• Participate in proactive team efforts to achieve departmental and company goals.
• Contribute to building a positive team spirit.
• Communicate effectively with all levels of employees.
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
• Maintain the highest degree of honesty and integrity at all times.
• Perform other duties as assigned.

Requirements

Job Qualifications:

• Due to export control rules, must be a US person.
• M.S. or Ph.D. degree in a physical science or engineering, or BS and +5 years’ experience in Advanced Packaging and Interconnects or Semiconductor Processing
• Experience with integrated wafer fabrication process flows

Job Skills:

• The successful candidate will have good hands-on laboratory skills, good verbal and written communication skills, and be able to work independently as well as within a group setting.

Benefits

• Medical, Dental, and Vision
• 401k
• Company Paid Basic Life Insurance, STD, and LTD
• Vacation Time
• Sick Time
• Holidays
• Tuition Reimbursement
• Pet Insurance
• Legal Insurance offered through Allstate
• Critical Illness, Hospitalization and Accident Insurance offered through Allstate