R&D Integration Engineer - Broadcom
Fort Collins, CO
About the Job
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Job Description:
Job Description
We are looking to hire a talented, highly motivated integration engineer to
develop new MEMS micro fabrication technologies. As an Integration Engineer
with Broadcom's Wireless Semiconductor Division (WSD), you will
develop new FBAR (Film Bulk Acoustic Resonator) piezoelectric MEMs process
technologies to support the wireless filter business. You will join our
process development engineering team and work alongside other manufacturing
and development engineers to develop and release new technologies for high
volume manufacturing.
The role will involve project management of new technology development
activities including scoping, technical work, on-time delivery, and
formal presentations. The role may also involve hands-on experimental work in
the cleanroom and characterization labs (25-75%). You will be expected
to understand key FBAR electrical and physical parameters and utilize CAD
software such as Cadence and ADS to extend FBAR value propositions for next
generation products. The successful candidate will be expected to function in
our highly-collaborative and team-oriented environment including
cross-functional groups on site and international teams.
Roles and Responsibilities
- Hands-on visual, mechanical, and electrical evaluation of wafers.
Validation of material to R&D specifications and manufacturing standards
using metrology and physical analysis.
- Develop and execute DOEs. Develop and verify root-cause models and
solutions.
- Lead technology development from concept to high-volume manufacturing
readiness
- May need to research and evaluate new capabilities from vendors and drive
the tool selection process.
- Create functional MEMS process flows while balancing competing engineering
concerns such as quality, cost, and time.
- View, understand, and create layout artwork.
- Apply understanding of device physics and radio frequency (RF)
technology to propose new processes and devices.
- Monitor technology developments in academia and industry
Qualifications
Technical Experience
- MS in EE, ME, Materials science, or related discipline with a minimum
of 6+ years of experience in semiconductor/MEMs processing or equivalent
or PhD in EE, ME, Materials science, or related discipline with a
minimum of 3+ years of experience in semiconductor/MEMs processing or
equivalen
- Industrial experience as an integration or development engineer with
hands-on expertise required. Candidates with significant university cleanroom
experience may be considered.
- Experience taking a device idea from initial process conception through high
volume production release preferred.
- First-hand experience and expertise with at least one unit process area such
as film dep, photo, etch, wafer bond, wet processing, etc.
- First-hand experience and expertise with BEOL processing steps such as
metallization, plating, RDL, vias, Cu pillars, wafer bonding
- Comfortable spending time in the cleanroom and physical analysis lab
designing, executing, and evaluating experiments.
- Knowledge of and practical experience in statistical analysis and SPC
methodology.
- Knowledge of semiconductor processing equipment, vendor roadmaps, and
previous experience in working with vendors to deliver necessary process
capabilities. Understanding and experience with the hardware, software,
control methodologies, and limitations of semiconductor processing equipment.
- Experience designing and implementing novel MEMS components such as
microresonators, pressure sensors, accelerometers, or other
piezoelectric devices preferred
- RF, FBAR, or BAW experience preferred
Project Management
- Proven ability to manage a technology development progra to a schedule.
- Ability to identify critical tasks and secure necessary resources.
- Ability to work well in a team environment, guiding the efforts of unit
process engineers and technicians.
- Track record of successful interaction with other functional areas of the
organization, such as Procurement, Operations, and Equipment Maintenance.
- Excellent communication and leadership skills.
- Experience and capability to lead team to successful resolution of issues.
Personal Attributes
- High level of personal ownership and self-motivation
- Delivery driven. Ability to identify critical tasks and drive
prioritization.
- Ability to work well in a team environment. Accept and provide constructive
feedback.
- Track record of successful interaction with other functional areas of a
manufacturing organization, such as procurement, operations, and
equipment maintenance.
- Excellent communication and leadership skills. History of leading team to
successful resolution of issues.
- Flexibility to contribute on multiple programs and shifting projects or
priorities.
- Desire to work on different technical topics and areas.
Additional Job Description:
Compensation and Benefits
1. If you are a first time user, please create your candidatelogin account
before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
Job Description
We are looking to hire a talented, highly motivated integration engineer to
develop new MEMS micro fabrication technologies. As an Integration Engineer
with Broadcom's Wireless Semiconductor Division (WSD), you will
develop new FBAR (Film Bulk Acoustic Resonator) piezoelectric MEMs process
technologies to support the wireless filter business. You will join our
process development engineering team and work alongside other manufacturing
and development engineers to develop and release new technologies for high
volume manufacturing.
The role will involve project management of new technology development
activities including scoping, technical work, on-time delivery, and
formal presentations. The role may also involve hands-on experimental work in
the cleanroom and characterization labs (25-75%). You will be expected
to understand key FBAR electrical and physical parameters and utilize CAD
software such as Cadence and ADS to extend FBAR value propositions for next
generation products. The successful candidate will be expected to function in
our highly-collaborative and team-oriented environment including
cross-functional groups on site and international teams.
Roles and Responsibilities
- Hands-on visual, mechanical, and electrical evaluation of wafers.
Validation of material to R&D specifications and manufacturing standards
using metrology and physical analysis.
- Develop and execute DOEs. Develop and verify root-cause models and
solutions.
- Lead technology development from concept to high-volume manufacturing
readiness
- May need to research and evaluate new capabilities from vendors and drive
the tool selection process.
- Create functional MEMS process flows while balancing competing engineering
concerns such as quality, cost, and time.
- View, understand, and create layout artwork.
- Apply understanding of device physics and radio frequency (RF)
technology to propose new processes and devices.
- Monitor technology developments in academia and industry
Qualifications
Technical Experience
- MS in EE, ME, Materials science, or related discipline with a minimum
of 6+ years of experience in semiconductor/MEMs processing or equivalent
or PhD in EE, ME, Materials science, or related discipline with a
minimum of 3+ years of experience in semiconductor/MEMs processing or
equivalen
- Industrial experience as an integration or development engineer with
hands-on expertise required. Candidates with significant university cleanroom
experience may be considered.
- Experience taking a device idea from initial process conception through high
volume production release preferred.
- First-hand experience and expertise with at least one unit process area such
as film dep, photo, etch, wafer bond, wet processing, etc.
- First-hand experience and expertise with BEOL processing steps such as
metallization, plating, RDL, vias, Cu pillars, wafer bonding
- Comfortable spending time in the cleanroom and physical analysis lab
designing, executing, and evaluating experiments.
- Knowledge of and practical experience in statistical analysis and SPC
methodology.
- Knowledge of semiconductor processing equipment, vendor roadmaps, and
previous experience in working with vendors to deliver necessary process
capabilities. Understanding and experience with the hardware, software,
control methodologies, and limitations of semiconductor processing equipment.
- Experience designing and implementing novel MEMS components such as
microresonators, pressure sensors, accelerometers, or other
piezoelectric devices preferred
- RF, FBAR, or BAW experience preferred
Project Management
- Proven ability to manage a technology development progra to a schedule.
- Ability to identify critical tasks and secure necessary resources.
- Ability to work well in a team environment, guiding the efforts of unit
process engineers and technicians.
- Track record of successful interaction with other functional areas of the
organization, such as Procurement, Operations, and Equipment Maintenance.
- Excellent communication and leadership skills.
- Experience and capability to lead team to successful resolution of issues.
Personal Attributes
- High level of personal ownership and self-motivation
- Delivery driven. Ability to identify critical tasks and drive
prioritization.
- Ability to work well in a team environment. Accept and provide constructive
feedback.
- Track record of successful interaction with other functional areas of a
manufacturing organization, such as procurement, operations, and
equipment maintenance.
- Excellent communication and leadership skills. History of leading team to
successful resolution of issues.
- Flexibility to contribute on multiple programs and shifting projects or
priorities.
- Desire to work on different technical topics and areas.
Additional Job Description:
Compensation and Benefits
Source : Broadcom
