Assembler-Wire Bonding - ICONMA, LLC
Chelmsford, MA 01824
About the Job
We are seeking a skilled Assembler to join our team in Chelmsford, MA, for a 12-month contract. The successful candidate will perform fabrication and modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Key responsibilities include:
If you are a military professional seeking impactful work in the civilian sector, consider exploring ICONMA’s job opportunities and contributing your expertise to the continued success of America’s Defense Industry. We thank you for your service and expertise, we would like to offer our expertise as a service to you in your future career endeavors.
As an equal opportunity employer, ICONMA provides an employment environment that supports and encourages the abilities of all persons without regard to race, color, religion, gender, sexual orientation, gender identity or express, ethnicity, national origin, age, disability status, political affiliation, genetics, marital status, protected veteran status, or any other characteristic protected by federal, state, or local laws.
- Gold Wire Bonding: Perform manual and automated gold wire bonding (0.001” and 0.0007” wires) and ribbon bonding to various substrates and components.
- Troubleshooting: Visually screen wire bonds or chip placements to troubleshoot defective hybrid circuit card assemblies.
- Component Installation: Install substrates and components in complex microwave assemblies using paste and sheet epoxies.
- Measurement and Inspection: Utilize measurement equipment (e.g., reticle, drop indicator, bond puller) to ensure units conform to specifications.
- Work Planning: Plan work sequences based on progress and schedule requirements.
- Collaboration: Work closely with Manufacturing and Quality Engineering teams on procedures and troubleshooting methodologies.
- Interim Secret Clearance or higher
- Experience in wire bonding and ribbon bonding (0.001” and 0.0007” wire and various sizes of ribbon).
- Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers, and other similar tools.
- Good dexterity and eye/hand coordination.
- Experience in microelectronics assembly (chip and wire assembly).
- Ability to read and work from detailed work instructions and drawings.
- High School Diploma required.
- Active Secret Clearance
- Experience in hybrid assembly in accordance with Mil STD 883.
- Experience with wire bonding or ribbon bonding to ceramic or duroid substrates.
- Familiarity with Westbond and Metcal bonding machines, and Unitech welder.
- Experience in substrate and component attach, auto pick-and-place.
If you are a military professional seeking impactful work in the civilian sector, consider exploring ICONMA’s job opportunities and contributing your expertise to the continued success of America’s Defense Industry. We thank you for your service and expertise, we would like to offer our expertise as a service to you in your future career endeavors.
As an equal opportunity employer, ICONMA provides an employment environment that supports and encourages the abilities of all persons without regard to race, color, religion, gender, sexual orientation, gender identity or express, ethnicity, national origin, age, disability status, political affiliation, genetics, marital status, protected veteran status, or any other characteristic protected by federal, state, or local laws.
Source : ICONMA, LLC