Design Engineer III - PCB/FPC design processes & digital, RF, Camera, Display, Audio at HCLTech

• Own and improve Meta PCB/FPC design processes, work with hardware team, contractors, and CM PCB teams to deliver fab releases.
• Own complex PCB/FPC designs, containing analog, digital, RF, Camera, Display, Audio, Sensors and power charging components.
• Manage and coach CM and PCB vendors on placement/routing/DFM/Working Gerber review to meet Meta design quality.
• Create and manage PCB documentation including fabrication and assembly packages, such as Gerber, ODB, BoM, fab and assembly drawings.
• Interface with board fabrication vendor to select proper materials and stack-up, use correct impedance and DFX rulesets.
• Work with assembly vendors to supply data and seek assembly design requirements. Resolve DFM and manufacturing related issues.
• Work with hardware engineers and document control departments to release fab and assembly packages into a company-wide PLM system. Author ECO’s if necessary.
• Work closely with ECAD librarians on maintaining and expanding the company-wide library.

Minimum Qualifications

• BS in EE or equivalent practical experience
• 5+ years of PCB design experience
• Experience with Cadence tool sets
• Experience in managing and coaching CMs and PCB vendors
• Prepare fabrication notes, assembly notes, and all deliverables, such as Gerber files, drill charts, PCB assembly BOMs, and other PCB and assembly related documents required by PCB fabrication vendors to build circuit boards for prototypes and products
• Experience interpreting datasheets and schematics, generating netlists and constraints, and using schematic for layout and routing reference
• Experience with PLM systems such as Agile
• Knowledge and understanding of IPC, JEDEC, IEEE, and other electronic standards
• Experience with HDI design. Knowledge of multilayer PCB layout, fabrication and assembly techniques including blind/buried vias, and microvias
• Experience with Rigid, Flex, and Rigid-Flex boards design and manufacturing
• Experience in PCB layout design constraints for mixed/RF signal, high speed signal impedance control, memory interfaces, power distribution, heat dissipation, and optimization for EMI performance

Preferred Qualifications

• Experience with mSAP technologies
• Experience with SiP technologies
• 10+ years experience of PCB layout design using Cadence Allegro
• Proven track record to design & manage all aspects of the printed board design used in high volume consumer products
• Experience in cost effective consumer electronics design
• Knowledge in EMC compliance, environmental safety compliance.