Education:- BS, MS or Ph.D. in Mechanical Engineering, Chemical Engineering, Materials Science and Engineering or similar disciplines.
Experience:- 2 to 5 years of hands-on experience in process control and manufacturing, or engineered materials industry.
- Experience in substrate grinding, lapping or polishing process is a strong plus.
- Experience in optical or mechanical characterization techniques for substrate surface or bevel shapes is a strong plus.
- Experience with statistical analysis tools such as JMP, Minitab, or R is a strong plus
- General knowledge of semiconductor materials, technological processes used in their manufacturing and methods of materials characterization.
- Demonstrated ability to achieve results independently or working with others
- Ability to recommend and implement improvements.
- Excellent interpersonal and communication skills.
Special Skills:- Knowledge of substrate processes that include grinding, beveling, and lapping.
- Hands-on experience with substrate characterization and use of optical, interferometric and other tools.
- Familiarity with statistical process control tools, such as Design of Experiments (DOE) and Minitab.
- Fluency with programs and tools used for data collection, analysis, modeling and plotting, such as Excel or similar.
- Ability to handle multiple priorities involving external and internal priorities
- Ability to excel in a cross-organizational, cross cultural, global team environment
- Handle special assignments promptly and professionally
- Set a high standard of ethics, professionalism, leadership, and competency
- Due to ITAR compliance, this position requires candidates to be a U.S. Citizen, Permanent Resident Alien, or Protected Individual per 8 U.S.C. 1324b(a)(3)
Demonstrates and promotes the II-VI Worldwide values:
- Customer First
- Honesty and Integrity
- Open Communications
- Teamwork
- Continuous Improvement and Learning
- Manage by the "Facts"
- A Safe, Clean and Orderly Workplace
Job Competencies:Individual Contributor
Adaptability, Customer Focus, Innovation, Planning and Organizing, Problem Solving, Decision Making and Continuous Improvement, Professional and Technical Knowledge and Skills, Reliable and Dependable, Results Oriented, Teamwork and Positive Relationships, Work Standards/Quality/ Details
Job Element
1) Optimization of Substrate Grinding Technology-30%
Optimizes substrate fabrication/ grinding technology. Contributes to ideas, concepts, approaches and engineering solutions. Provides technical and engineering support to the manufacturing team. Focuses on specific technological elements with the goals of improving yields, throughput and meeting the requirements of customers and R&D contracts. Ensures that each technological step is properly documented, reviewed, validated, approved and Provides feedback to the R&D Center that will help improve manufacturing processes, improve yield and lower cost.Uses statistical tools such as SPC, DOE or similar in the process development and data analysis.2) Support for Substrate Grinding Operations-20%
Performs technological steps of commercial substrate grinding. Ensures that each step is carried out in accordance with our standard technological procedures.Performs process and equipment troubleshooting, problem identification and corrective action activities.Instructs and trains Process technicians.Assists Production Manager in planning, scheduling and resource allocation for fabrication and polishing.3) R&D Programs-10%
Participates in R&D Programs by organizing and carrying out project activities. Adheres to the project timelines and milestones.Summarizes experimental results in formal or informal written and oral reports. Participates in R&D meetings by providing reports, plans, meeting minutes, action items and other requested documentation.Participates in report and proposal writing activities and writes sections as assigned by Program Manager. Helps to prepare and deliver presentations to government contract monitoring personnel.4) Characterization of Technological Processes-20%
Using statistical tools performs characterization of technological processes to determine process reliability and bottlenecks. Analyses process/product failure modes.Characterizes fabrication processes to determine process reliability and "bottlenecks". Analyzes process/product failure modes and provides feedback for process optimization.Provides rapid feedback to the SiC production team such that they can optimize the processes, maximize the yields and improve the product quality.Contributes to the work of the quality assurance team by providing expertise in process characterization. Serves as a resource to the QA personnel with respect to the characterization techniques, equipment, and procedures.5) Substrate Characterization-15%
Actively participates in characterization of substrates. Analyzes the obtained characterization data to establish fundamental trends and correlations and to develop scientifically sound conclusions.Uses the results of characterization to establish factors that affect crystal quality and to make recommendations for the technology optimization.Communicates the ideas, experimental and analytical results to the WBG team in a timely manner to accelerate the technology progress.7) Human Resources / Administrative-3%
An ESGP is co-developed and pursued.Accurate recording of work is maintainedCompany policy is followed regarding all safety, environmental and ergonomic requirements.Responsible for maintaining a quality work environment housekeeping standards.Cooperative in working with others.Adapts readily to changes in work caused by new requirements and/or situations.Effectiveness: Deals well with differences of opinion, manner and style; Seeks ideas from others; pursues simple solutions to everyday problems.Teamwork: Contributes to a cohesive working group; Demonstrates commitment to and enthusiasm for team goals; Demonstrates cooperation and coordination with all participants in the annual ESGP activity.Communication: Expresses ideas openly, accurately and succinctly in both oral and written forms; effectively listens to and assimilates information from others; presents organized trains of thought; assures timely and adequate information exchanges.Self-motivates, responsible for the II-VI ESGP appraisal system with regard to your own career and personal development.8) Special Assignments-2%
As assigned and directed by management.Coherent is a global leader in lasers, engineered materials and networking components. We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program. It's an exciting opportunity to work for a company that offers stability, longevity and growth. Come Join Us!
Note to recruiters and employment agencies: We will not pay for unsolicited resumes from recruiters and employment agencies unless we have a signed agreement and have required assistance, in writing, for a specific opening.Works within a team of engineers and technicians on projects and specific tasks related to the manufacturing of wide bandgap semiconductor substrates. Actively participates in Engineering and R&D projects and commercial substrate manufacturing. Designs and carries out experiments related to material processing and substrate fabrication and analyzes their results. Characterizes produced substrates using all necessary tools and techniques, including those available at II-VI, as well as from other sources. Investigates and models experimental data to establish correlations and trends. Develops, optimizes and sustains manufacturing processes of substrate grinding. Establishes process capability and reliability benchmarks using Statistical Process Control methodologies. Finds innovative solutions to technical problems that lead to the improved product quality, increased yields and throughput.