Hardware Engineer - TPI Global (formerly Tech Providers, Inc.)

Hardware Engineer
12+ Months Contract
Seattle, WA (100% Onsite)
 
Must have/Primary skills: Circuit Design, Bring-up, Debug, Protocols, NPI, PCB design, Altium/Cadence design, Schematic capture, PCB layout
Experience: 7+ year
 
Candidate responsibilities

• Partner with Design, Engineering and Research teams to identify and solve complex design and technological challenges.
• Specifying components, building schematics, completing board layouts, assembling, testing, debugging, and integrating designs into opto-electro-mechanical systems
• Collaborating in a team environment with cross-functional teams such system engineering, architecture, product design,, NPI and research. PCB design, Multi-Layer (NXP, TI, Qualcomm)
• Transforming vendor and internal reference designs into custom solutions
• Ability to execute multiple streams of work simultaneously and independently balance and prioritize project workload to ensure success against timeline constraints

 
What You'll Be Doing:

• 4+ years of experience with system-level electrical design including circuit design, system bring-
• up, integration, and debug
• Experience in several of the following topics: low-power circuit design, DC/DC converters, power management methods, audio circuit design, high speed signals, and analog design
• Experience with microcontrollers, microprocessor digital circuit design and various
• communications protocols such as I2C, UART, SPI, USB, MIPI CSI/DSI, I2S, LPDDR, SDIO etc.
• Experience with mixed-signal board-level design
• Hands-on experience with debugging and related equipment (Oscilloscope, Multimeters, Logic Analyzers, etc.).
• Strong collaborator, excellent communication skills with experience with cross-team and cross- geography collaboration
• Experience with design development from schematic capture, PCB layout through assembly
• Experience with Altium or Cadence design tools.

 
What We Are Looking For:

• 7+ years of end-to-end integrated product development experience, including early-stage conceptual design, detailed design for manufacturing and assembly, late-stage mass production experience, overseas manufacturing and assembly
• Experience leading a multidisciplinary product engineering team, with oversight into mechanical, electrical, and firmware workstreams and integration between disciplines
• Systems-level engineering experience with complex integrated electromechanical assemblies
• Experience integrating RF technologies such as WIFI, BT, GPS, etc
• Experience with cameras and optical systems
• Experience leading and driving design development from schematic capture, PCB layout through.