Microelectronics ASIC Design Engineer at Leidos

Description

The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions.  Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.

Primary Responsibilities:

• The successful candidate will support technical and programmatic assessments of technologies, capabilities, materials, equipment, and performers in support of the advancement of the U.S. Defense Industrial Base’s (DIB) access to trusted, state-of-the-art microelectronics.

• This position will interface and collaborate with a range of engineers, scientists, policy makers, and executives within the government, industry and academia across the country..

• Provide occasional technical support and/or field support planning, and other field support in general if needed.

• Conduct experimental tests on latest SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.

• Interact with outside customers, suppliers, and functional peer groups.

• Some travel and work at remote sites for limited time periods may be occasionally required.

• Provide status reports to project managers and/or division production manager as required.

Basic Qualifications:

• U.S. Citizenship with the ability to obtain a TS clearance.

• BS and 8 years required. Masters Degree in Electrical Engineering, Computer Engineering, Computer Science or related technical discipline desired with 6+ years of experience

• Experience with DSP fundamentals and FPGA implementation

• Experience with Matlab/Simulink

• Experience with microchip EDA tools and flows (Synopsys, Cadence, etc.)

• Microelectronics hardware subject matter expertise in at least (1) of the areas listed below AND experience in (1) additional area listed below:

• Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction)

• Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.)

• Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability)

• Hardware Programming: FPGA (i.e. Verilog, VHDL), Programming (Linux command line/scripting, Python, Java, and C++)

Preferred Qualifications:

• 8+ years experience in leading a design team

• Experience in hardware test and measurement and hands-on lab debug

• Experience with interfaces: ADC/DACs, SerDes, PCIe, JTAG, DDRx

LInC

Electronic Warfare

Original Posting Date:

While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.