Packaging Engineering Intern - Santa Clara - Texas Instruments
Santa Clara, CA
About the Job
Description
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.
Put your talent to work with us as a Packaging Engineering Intern – change the world, love your job!
Qualifications
Minimum Requirements:
+ Currently pursuing an Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, or Electrical Engineering.
+ Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications:
+ Knowledge on wide-band-gap device (GaN, SiC)
+ Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)
+ Demonstrated analytical and problem solving skills
+ Strong written and verbal communication skills
+ Ability to work in teams and collaborate effectively with people in different functions
+ Strong time management skills that enable on-time project delivery
+ Ability to build strong, influential relationships
+ Ability to work effectively in a fast-paced and rapidly changing environment
+ Ability to take the initiative and drive for results
Why TI?
+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
+ Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
About Texas Instruments
As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable.
_Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws._
_If you are interested in this position, please apply to this requisition._
Status Regular
Job: Engineering - Product Dev
Primary Location: US-CA-Santa Clara
Work Locations: Santa Clara > Santa Clara, CA (Bldg A) Santa Clara
Req ID: 240003NL
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.
Put your talent to work with us as a Packaging Engineering Intern – change the world, love your job!
Qualifications
Minimum Requirements:
+ Currently pursuing an Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, or Electrical Engineering.
+ Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications:
+ Knowledge on wide-band-gap device (GaN, SiC)
+ Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)
+ Demonstrated analytical and problem solving skills
+ Strong written and verbal communication skills
+ Ability to work in teams and collaborate effectively with people in different functions
+ Strong time management skills that enable on-time project delivery
+ Ability to build strong, influential relationships
+ Ability to work effectively in a fast-paced and rapidly changing environment
+ Ability to take the initiative and drive for results
Why TI?
+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
+ Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
About Texas Instruments
As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable.
_Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws._
_If you are interested in this position, please apply to this requisition._
Status Regular
Job: Engineering - Product Dev
Primary Location: US-CA-Santa Clara
Work Locations: Santa Clara > Santa Clara, CA (Bldg A) Santa Clara
Req ID: 240003NL
Source : Texas Instruments