Physical Infrastructure Process Technology Staff Engineer - Google
Sunnyvale, CA
About the Job
Minimum qualifications:
- Bachelor's degree in Mechanical Engineering, Product Design, a related field, or equivalent practical experience.
- 8 years of experience in design and analysis of electro-mechanical systems and products.
- Experience in Chip Package Interaction (CPI), packaging materials, SMT process, thermal, package development, and manufacturing.
- Experience in technical innovation.
Preferred qualifications:
- PhD in Mechanical Engineering, Product Design, or a related field.
- Experience in model and simulate the structural mechanical stress of the 3D integrated chip to system stack up, under various thermal loading conditions.
- Experience with multidisciplinary interactions between chip/packaging technology, board and rack system.
- Experience with global cross-functional collaboration and leadership.
- Knowledge of 2.5D silicon interposer and silicon bridge technologies, packaging technologies, and L1/L2 manufacturing/test quality and processes.
- Knowledge of Surface Mount Technology (SMT) manufacturing/test processes including defining recipes for new technologies with a focus on warpage control.
About the job
Our computational challenges are so big and unique we can't just buy our hardware, we've got to make it ourselves. Our Platforms Team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Mechanical Engineer you design and evaluate our data center systems, identifying product requirements and contributing to research and project planning. From the chip to chiller, you are responsible for designing and optimizing an architecture that will scale with Google's continued growth.With your technical expertise, you lead and manage projects, develop product and process improvements, provide consultation to others and help facilitate training and development.
As Physical Product Design technologist, you will work jointly with the chip-package team and Hardware System team to explore new package, system, or manufacturing process architectures and designs for Machine Learning (ML) systems, leveraging advanced package technologies, PCB technologies, interconnects, cooling, power, that will enable scale up performance of future generations of ML systems. You will be directing and exploring package and system physical co-design scale manufacturing solutions, through early feasibility exploration with test vehicles and hardware prototyping of manufacturing processes, with focus on achieving thermal, mechanical, interconnect and power delivery performance goals that are scalable to high volume manufacturing. Additionally, you will work with multi-functional cross teams from different organizations, and various suppliers to enable the new ML hardware system.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
The US base salary range for this full-time position is $168,000-$252,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Lead the innovation pathfinding for next generation ML system physical design, that spans from chips to systems. This includes requirements gathering, concept generations, detailed design, manufacturing processes and test plans with analysis, and a focus on integrating new technologies with high volume manufacturing quality.
- Influence and shape future products by providing packaging, manufacturing process and product design engineering expertise into the technology roadmap with data-driven decisions.
- Identify and scope projects around innovation opportunities as well as technology risks.
- Provide technical leadership and guidance in new infrastructure development products, working with multiple cross-functional internal teams and external ecosystem partners.
- Lead execution of critical deliverables, particularly for large infrastructure development products. Key contributor to physical infrastructure roadmap and architecture development. Maintain and improve infrastructure development and qualification process.