Principal Photonics/Semiconductor Packaging Engineer - Acacia - Cisco
Holmdel, NJ
About the Job
Application window is expected to close on 10/10/24
Acacia designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.
What you'll do:
You will play a key role in the design, development, and transfer to production of leading-edge transceivers utilizing silicon photonics and advanced DSP technology. In addition, you will:
* Develop new package architecture and integration concepts
* Work with OSATs to bring new products to volume production
* Solve technical problems encountered in product prototyping, qualification, and production
* Drive product solutions toward high-performance, high-reliability and low-cost
Who you'll work with:
You will be part of a multi-disciplinary team, including optical, mechanical, electrical, and manufacturing engineers. You will collaborate closely with Acacia’s Silicon Photonics development team on new product designs and with the Product Engineering and Quality teams to ensure smooth transition of our products to Manufacturing.
Who you are:
You have a deep knowledge of semiconductor packaging and a great understanding of how to make high-volume, high-reliability products. You contribute at all stages of product development, from concept to production.
You are enthusiastic about engineering and seeing your effort contribute to a great product in real-world applications. You are detail-oriented and enthusiastic about digging into difficult technical problems. You can work independently, but you appreciate a friendly, team-oriented, collaborative work environment. You enjoy learning from your colleagues and letting them learn from you. Your great interpersonal and communication skills allow effortless collaboration within and across teams and help steer projects in a positive direction.
Minimum Qualifications:
* BS degree with 12+ years of experience in photonics/semiconductor packaging or a Master's/Ph.D. with 10+ years of experience in photonics/semiconductor packaging.
* 10+ years of experience with semiconductor assembly processes such as die bonding, wire-bonding and 2.5D/3D assembly.
* Knowledge of back-end wafer processing.
* Knowledge of materials characterization and failure analysis, IC packaging materials and back-end wafer-level processes.
* Knowledge of SiPh/PIC packaging, including mechanical, thermal, optics, and RF aspects.
Preferred Qualifications:
* Experience working with OSATs and CMs on volume manufacturing.
* Experience with laser packaging.
* Experience with FEA software for thermal or mechanical analysis.
Why Cisco?
#WeAreCisco. We are all unique, but collectively we bring our talents to work as a team, to develop innovative technology and power a more inclusive, digital future for everyone. How do we do it? Well, for starters - with people like you!
Nearly every internet connection around the world touches Cisco. We’re the Internet’s optimists. Our technology makes sure the data traveling at light speed across connections does so securely, yet it’s not what we make but what we make happen which marks us out. We’re helping those who work in the health service to connect with patients and each other; schools, colleges, and universities to teach in even the most challenging of times. We’re helping businesses of all shapes and sizes to connect with their employees and customers in new ways, providing people with access to the digital skills they need and connecting the most remote parts of the world - whether through 5G, or otherwise.
We tackle whatever challenges come our way. We have each other’s backs, we recognize our accomplishments, and we grow together. We celebrate and support one another - from big and small things in life to big career moments. And giving back is in our DNA (we get 10 days off each year to do just that).
We know that powering an inclusive future starts with us. Because without diversity and a dedication to equality, there is no moving forward. Our 30 Inclusive Communities, that bring people together around commonalities or passions, are leading the way. Together we’re committed to learning, listening, caring for our communities, whilst supporting the most vulnerable with a collective effort to make this world a better place either with technology, or through our actions.
So, you have colorful hair? Don’t care. Tattoos? Show off your ink. Like polka dots? That’s cool. Pop culture geek? Many of us are. Passion for technology and world changing? Be you, with us! #WeAreCisco
Cisco is an Affirmative Action and Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.
Cisco will consider for employment, on a case by case basis, qualified applicants with arrest and conviction records.
Acacia designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.
What you'll do:
You will play a key role in the design, development, and transfer to production of leading-edge transceivers utilizing silicon photonics and advanced DSP technology. In addition, you will:
* Develop new package architecture and integration concepts
* Work with OSATs to bring new products to volume production
* Solve technical problems encountered in product prototyping, qualification, and production
* Drive product solutions toward high-performance, high-reliability and low-cost
Who you'll work with:
You will be part of a multi-disciplinary team, including optical, mechanical, electrical, and manufacturing engineers. You will collaborate closely with Acacia’s Silicon Photonics development team on new product designs and with the Product Engineering and Quality teams to ensure smooth transition of our products to Manufacturing.
Who you are:
You have a deep knowledge of semiconductor packaging and a great understanding of how to make high-volume, high-reliability products. You contribute at all stages of product development, from concept to production.
You are enthusiastic about engineering and seeing your effort contribute to a great product in real-world applications. You are detail-oriented and enthusiastic about digging into difficult technical problems. You can work independently, but you appreciate a friendly, team-oriented, collaborative work environment. You enjoy learning from your colleagues and letting them learn from you. Your great interpersonal and communication skills allow effortless collaboration within and across teams and help steer projects in a positive direction.
Minimum Qualifications:
* BS degree with 12+ years of experience in photonics/semiconductor packaging or a Master's/Ph.D. with 10+ years of experience in photonics/semiconductor packaging.
* 10+ years of experience with semiconductor assembly processes such as die bonding, wire-bonding and 2.5D/3D assembly.
* Knowledge of back-end wafer processing.
* Knowledge of materials characterization and failure analysis, IC packaging materials and back-end wafer-level processes.
* Knowledge of SiPh/PIC packaging, including mechanical, thermal, optics, and RF aspects.
Preferred Qualifications:
* Experience working with OSATs and CMs on volume manufacturing.
* Experience with laser packaging.
* Experience with FEA software for thermal or mechanical analysis.
Why Cisco?
#WeAreCisco. We are all unique, but collectively we bring our talents to work as a team, to develop innovative technology and power a more inclusive, digital future for everyone. How do we do it? Well, for starters - with people like you!
Nearly every internet connection around the world touches Cisco. We’re the Internet’s optimists. Our technology makes sure the data traveling at light speed across connections does so securely, yet it’s not what we make but what we make happen which marks us out. We’re helping those who work in the health service to connect with patients and each other; schools, colleges, and universities to teach in even the most challenging of times. We’re helping businesses of all shapes and sizes to connect with their employees and customers in new ways, providing people with access to the digital skills they need and connecting the most remote parts of the world - whether through 5G, or otherwise.
We tackle whatever challenges come our way. We have each other’s backs, we recognize our accomplishments, and we grow together. We celebrate and support one another - from big and small things in life to big career moments. And giving back is in our DNA (we get 10 days off each year to do just that).
We know that powering an inclusive future starts with us. Because without diversity and a dedication to equality, there is no moving forward. Our 30 Inclusive Communities, that bring people together around commonalities or passions, are leading the way. Together we’re committed to learning, listening, caring for our communities, whilst supporting the most vulnerable with a collective effort to make this world a better place either with technology, or through our actions.
So, you have colorful hair? Don’t care. Tattoos? Show off your ink. Like polka dots? That’s cool. Pop culture geek? Many of us are. Passion for technology and world changing? Be you, with us! #WeAreCisco
Cisco is an Affirmative Action and Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.
Cisco will consider for employment, on a case by case basis, qualified applicants with arrest and conviction records.
Source : Cisco