Process Development Engineer - Samtec, Inc
Colorado Springs, CO
About the Job
Founded in 1976, Samtec is a privately held, $1 Billion global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.
Samtec is seeking a Process Development Engineer for the Colorado Springs, CO location. The salary range for this position is $100,000 - $130,000 per year inclusive of applicable bonus and commensurate with experience. Standard benefit offerings available are medical (HSA/PPO), dental, vision, group life, AD&D, short and long term disability, EAP, 401k plus other voluntary options as well as time off.
- Assembly Engineering support to review Customer requirements and determine the correct processes, materials, hardware and time frame needed to meet build requirements.
- Interaction as required with both internal and external customers regarding product specification reviews and technical issues.
- Responsible for conducting thorough Design of Experiments on new Assembly Processes with the goal of developing new process technology and improving early product life cycle assembly yield
- Collect and analyze process development data and information to determine next steps in process and product qualification cycles.
- Generate detailed reports and specifications documenting all experimental and process findings and procedures. Provide DOE, SPC, and yield reporting in a clear and presentable format.
- Evaluate and provide recommendations on new equipment to support continuous technology improvements to meet future customer requirements.
- Responsible for programming and assembling parts through product development cycles for both automated and non-automated processes, particularly in the die attach, wire bonding and epoxy dispensing process areas. Documents processes and procedures accordingly.
- Participates and drives FMEA and PFMEAs where applicable.
- Must be able to work independently and interact with colleagues, customers and vendors as necessary to achieve program objectives.
- Work in a manufacturing environment where prioritization amongst production and development work must be balanced and feedback loops between production and development engineers must be continuous.
- 7+ years of semiconductor, optoelectronics or microelectronics packaging process and equipment engineering experience. Die bonding experience is strongly preferred
- Materials used for standard package technology, PCBA, Optoelectronics, and assorted substrates.
- Demonstrated experience in assembly process development.
- Ability to meet International Traffic in Arms Regulations (ITAR) compliance requirements
- Hands-on experience of the equipment and materials that are used in the industry.
- Hands-on experience operating equipment to perform a specific process.
- Demonstrated experience in problem-solving and root cause analysis.
- MS Office Excel, Powerpoint, Word and Sharepoint proficiency is required
- Experience in DOE and data analysis software, like JMP, is preferred.
- Experience in microelectronic / microsystem package design and SolidWorks, AutoCAD, or other engineering design, modeling or simulation software is desirable.
- Excellent written and verbal communication skills with ability to frame the topic for easy understanding, propose constructive ideas, and communicate can do attitude.
- Must be a self-starter with strong leadership skills.
- Excellent interpersonal skills in relating to positively engage with both internal and external customers.
- Personal flexibility is necessary to ensure efficient execution of the plan and teamwork.
- Bachelor’s Degree in Engineering (Mechanical, Electrical, Chemical, Material Science) or equivalent is required.