Senior Mechanical Engineer (Thermal Design) (8110) - QORVO TEXAS LLC
Richardson, TX
About the Job
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.
We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges.
Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense.
Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.
RESPONSIBILITIES
- Senior level Mechanical Engineer developing next generation microelectronic packaging technology integrating RF, analog, and digital technology semiconductor devices
- Chosen candidate will work closely with select team of IC designers, circuit designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward
- UsingFEAand other industry standard simulations tools:
- Perform detailed modeling and optimization of thermal/mechanical design at the die/package/boardlevel
- Perform mechanical stress modeling and optimizationat the die/package/boardlevel
- Develop measurement and modeling tools to support thermal and stress analysis for internal and external customers
- Guide package and substrate design decisions that meet performance specifications and yield requirements
- In conformance with Qorvo standards, develop and document new products for prototype, limited production, and production release
- Supervise and respond to manufacturing issues as they occur
- Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends
- Support external customers with applications thermal models and failure analysis support
QUALIFICATIONS:
- BSME/MSME degree in mechanicalengineering or other relevant field witha minimum of 8 years experience in semiconductor packaging or electronic thermal analysis or similar technical experience
- Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
- Expert level skill withANSYSand Solidworks, or similar
- Knowledge of legacy and advanced microelectronic package technologies for commercial,defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
- Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense,encapsulation, and solder reflow
- Knowledge of microelectronic inspection tools and equipment including capabilities and limitations.Similar knowledge of failure analysis techniques and equipment
- Knowledge of reliability calculationmethods for semiconductors
- Understanding of GDandT, ANSI standards and tolerance stack-ups required
- Demonstrated ability to work with cross-functional teams
- Excellent verbal communication and interpersonal skills
- Excellent written communications skills
*This position is not eligible for visasponsorship by the Company.*
*This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.*
MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.
We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges.
Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense.
Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.
RESPONSIBILITIES
- Senior level Mechanical Engineer developing next generation microelectronic packaging technology integrating RF, analog, and digital technology semiconductor devices
- Chosen candidate will work closely with select team of IC designers, circuit designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward
- UsingFEAand other industry standard simulations tools:
- Perform detailed modeling and optimization of thermal/mechanical design at the die/package/boardlevel
- Perform mechanical stress modeling and optimizationat the die/package/boardlevel
- Develop measurement and modeling tools to support thermal and stress analysis for internal and external customers
- Guide package and substrate design decisions that meet performance specifications and yield requirements
- In conformance with Qorvo standards, develop and document new products for prototype, limited production, and production release
- Supervise and respond to manufacturing issues as they occur
- Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends
- Support external customers with applications thermal models and failure analysis support
QUALIFICATIONS:
- BSME/MSME degree in mechanicalengineering or other relevant field witha minimum of 8 years experience in semiconductor packaging or electronic thermal analysis or similar technical experience
- Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
- Expert level skill withANSYSand Solidworks, or similar
- Knowledge of legacy and advanced microelectronic package technologies for commercial,defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
- Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense,encapsulation, and solder reflow
- Knowledge of microelectronic inspection tools and equipment including capabilities and limitations.Similar knowledge of failure analysis techniques and equipment
- Knowledge of reliability calculationmethods for semiconductors
- Understanding of GDandT, ANSI standards and tolerance stack-ups required
- Demonstrated ability to work with cross-functional teams
- Excellent verbal communication and interpersonal skills
- Excellent written communications skills
*This position is not eligible for visasponsorship by the Company.*
*This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.*
MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.
Source : QORVO TEXAS LLC
