Senior Microelectronics Process Engineer - TAP Engineering
Fort Meade, MD
About the Job
Job ID: TAP00092
Position: Senior Microelectronics Process Engineer
Location: US – MD, Fort Meade (or surrounding area)
Category: Hardware
Clearance Requirement: Active TS/SCI w/ full scope polygraph
Education Requirement: BS in Mechanical, Manufacturing, Chemical, Materials Science, or Electrical Engineering (or related technical field)
Experience Requirement: 15 Years
TAP is seeking to hire a Senior Microelectronics Process Engineer to join our team! If you are a highly motivated engineer who enjoys a challenging and dynamic environment where your contributions are both critical and valued, this company will provide you the tools and opportunity to thrive.
The Senior Microelectronics Process Engineer will lead and support microelectronics manufacturing projects at all levels of integration: die/wafer, component level packaging, multi-chip module (MCM), printed circuit board (PCB), and system level packaging.
Required Qualifications:
Clearance Requirement: This position requires ability to obtain and maintain a Top Secret/SCI security clearance, based on current background investigation (SBI), as well as the favorable completion of full scope polygraph. Clearance and polygraph processing will be completed by the U.S. Government. Factors considered for a U.S. Government Security Clearance include, but are not limited to:
TAP Engineering is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status or other characteristics protected by law. Learn more about your rights under Federal EEO laws and supplemental language.
Position: Senior Microelectronics Process Engineer
Location: US – MD, Fort Meade (or surrounding area)
Category: Hardware
Clearance Requirement: Active TS/SCI w/ full scope polygraph
Education Requirement: BS in Mechanical, Manufacturing, Chemical, Materials Science, or Electrical Engineering (or related technical field)
Experience Requirement: 15 Years
TAP is seeking to hire a Senior Microelectronics Process Engineer to join our team! If you are a highly motivated engineer who enjoys a challenging and dynamic environment where your contributions are both critical and valued, this company will provide you the tools and opportunity to thrive.
The Senior Microelectronics Process Engineer will lead and support microelectronics manufacturing projects at all levels of integration: die/wafer, component level packaging, multi-chip module (MCM), printed circuit board (PCB), and system level packaging.
Required Qualifications:
- Active TS/SCI w/ full scope polygraph
- BS in Mechanical, Manufacturing, Chemical, Materials Science, or Electrical Engineering (or related technical field)
- 15 Years of overall engineering experience
- 11 years of experience working in electronics hardware manufacturing
- Experience fabricating, assembling and qualifying 1st article engineering prototypes
- Experience with hands-on electronics fabrication (i.e. soldering)
- Experience designing, validating and optimizing process leveraged in the fabrication of microelectronics hardware
- Experience developing, iterating, troubleshooting, documenting, and communicating manufacturing processes within a production environment
- Experience interpreting test and failure analysis results, and providing recommendations or alternatives
- Experience researching, evaluating, selecting and recommending electronic materials (i.e. underfill, overmold, die attach, adhesives, thermal interface materials, etc.)
- Experience with development, capture and flow-down of technical requirements
- Experience developing and executing test plans and procedures
- Technical writing, communication, and interpersonal skills
- MS in Mechanical, Manufacturing, Chemical, Materials Science, or Electrical Engineering (or related technical field)
- Familiarity with the following packaging and interconnect technologies/processes: Chip Scale Packaging, BGA Packaging, Multi-Chip Module Packaging, High Density Interconnect, Stacked Die Interconnect, Flip Chip Interconnect, Wirebonding, Redistribution Layers (RDL), Fan-Out-Wafer-Level Packaging (FOWLP), SMT Assembly, Thermal Compression Bonding, Gold Stud Bump Bonding, Low Stand-Off Underfilling, Wafer-to-Wafer and Die-to-Wafer Bonding
- Experience programming and operating automated production equipment (i.e. wafer thin/backgrind, wafer dice, die pick and place, wirebond, SMT pick and place, SMT reflow, Xray Inspection, Automated Optical Inspection, etc.)
Clearance Requirement: This position requires ability to obtain and maintain a Top Secret/SCI security clearance, based on current background investigation (SBI), as well as the favorable completion of full scope polygraph. Clearance and polygraph processing will be completed by the U.S. Government. Factors considered for a U.S. Government Security Clearance include, but are not limited to:
- U.S. Citizenship
- Favorable Criminal History Check
- Education Verification
- Abuse/Illegal Drug Use
- Credit Check
- Subject Interview
TAP Engineering is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status or other characteristics protected by law. Learn more about your rights under Federal EEO laws and supplemental language.
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Source : TAP Engineering
