Silicon Photonics Packaging Engineer - Ouster
San Francisco, CA
About the Job
At Ouster, we build sensors and tools for engineers, roboticists, and researchers, so they can make the world safer and more efficient
We've transformed LIDAR from an analog device with thousands of components to an elegant digital device powered by one chip-scale laser array and one CMOS sensor
The result is a full range of high-resolution LIDAR sensors that deliver superior imaging at a dramatically lower price
Our advanced sensor hardware and vision algorithms are used in autonomous cars, drones and many other applications
If you’re motivated by solving big problems, we’re hiring key roles across the company and need your help!We are looking for a Silicon Photonics Packaging Engineer to design and develop our IC packaging solutions
We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development
The role is San Francisco based and will include some travel.RESPONSIBILITIES:Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integrationDefine specifications for custom IC package designs and chip carriers to meet product and qualification requirements
Work with external partners to realize those partsPlan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualificationLead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assemblyCollaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.Drive mass production readiness with multiple engineering and operation teamsBASIC QUALIFICATIONS:5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree. Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substratesExperience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.Understanding of CMOS image sensor sensor architecture and operation is preferredBONUS QUALIFICATIONS:Bachelor's and/or Master's degree in Electrical or Mechanical EngineeringExperience with optical systems Experience with ATE package test environmentExperience with statistical analysis for volume production processesAEC-Q100 or related automotive qualification experience$120,000 - $180,000 a yearThe base pay will depend on your skills, work experience, location, and qualifications
This role may also be eligible for equity & benefits.We acknowledge the confidence gap at Ouster
You do not need to meet all of theserequirements to be the ideal candidate for this role.At Ouster we offer a range of competitive benefits, as we believe in taking care of our employees in all aspects of their lives
Our newly renovated office, located in the Mission District of San Francisco, is a dog-friendly workplace with a kitchen stocked with snacks, fresh fruit and drinks, and a complimentary dinner catered nightly
Additional perks include 15 vacation days/10 paid holidays annually; paid parental leave; pre-tax commuter or health care/dependent care accounts; 401K match up to 4%; medical, vision and dental plans with premiums covered at 100% for the employee and 75% for dependents (Cigna or Kaiser); life insurance; and short term disability and long term disability
Ouster offers the best benefit options available because we consider the well-being of our employees a top priority.Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce
Ouster does not make employment decisions on the basis of race, color, religion, ethnic or national origin, nationality, sex, gender, gender-identity, sexual orientation, disability, age, military status, or any other basis protected by local, state, or federal laws
Ouster also strives for a healthy and safe workplace, and prohibits harassment of any kind
Pursuant to the San Francisco Fair Chance Ordinance, Ouster considers qualified applicants with arrest and conviction records for employment
If you have a disability or special need that requires accommodation, please let us know.SummaryLocation: San Francisco, CA, United StatesType: Full TimeExperience: ExperiencedDepartment: Hardware Engineering
We've transformed LIDAR from an analog device with thousands of components to an elegant digital device powered by one chip-scale laser array and one CMOS sensor
The result is a full range of high-resolution LIDAR sensors that deliver superior imaging at a dramatically lower price
Our advanced sensor hardware and vision algorithms are used in autonomous cars, drones and many other applications
If you’re motivated by solving big problems, we’re hiring key roles across the company and need your help!We are looking for a Silicon Photonics Packaging Engineer to design and develop our IC packaging solutions
We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development
The role is San Francisco based and will include some travel.RESPONSIBILITIES:Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integrationDefine specifications for custom IC package designs and chip carriers to meet product and qualification requirements
Work with external partners to realize those partsPlan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualificationLead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assemblyCollaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.Drive mass production readiness with multiple engineering and operation teamsBASIC QUALIFICATIONS:5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree. Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substratesExperience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.Understanding of CMOS image sensor sensor architecture and operation is preferredBONUS QUALIFICATIONS:Bachelor's and/or Master's degree in Electrical or Mechanical EngineeringExperience with optical systems Experience with ATE package test environmentExperience with statistical analysis for volume production processesAEC-Q100 or related automotive qualification experience$120,000 - $180,000 a yearThe base pay will depend on your skills, work experience, location, and qualifications
This role may also be eligible for equity & benefits.We acknowledge the confidence gap at Ouster
You do not need to meet all of theserequirements to be the ideal candidate for this role.At Ouster we offer a range of competitive benefits, as we believe in taking care of our employees in all aspects of their lives
Our newly renovated office, located in the Mission District of San Francisco, is a dog-friendly workplace with a kitchen stocked with snacks, fresh fruit and drinks, and a complimentary dinner catered nightly
Additional perks include 15 vacation days/10 paid holidays annually; paid parental leave; pre-tax commuter or health care/dependent care accounts; 401K match up to 4%; medical, vision and dental plans with premiums covered at 100% for the employee and 75% for dependents (Cigna or Kaiser); life insurance; and short term disability and long term disability
Ouster offers the best benefit options available because we consider the well-being of our employees a top priority.Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce
Ouster does not make employment decisions on the basis of race, color, religion, ethnic or national origin, nationality, sex, gender, gender-identity, sexual orientation, disability, age, military status, or any other basis protected by local, state, or federal laws
Ouster also strives for a healthy and safe workplace, and prohibits harassment of any kind
Pursuant to the San Francisco Fair Chance Ordinance, Ouster considers qualified applicants with arrest and conviction records for employment
If you have a disability or special need that requires accommodation, please let us know.SummaryLocation: San Francisco, CA, United StatesType: Full TimeExperience: ExperiencedDepartment: Hardware Engineering
Source : Ouster