Silicon Photonics Packaging Engineer - Women Impact Tech, LLC

RESPONSIBILITIES:

• Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration
• Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts
• Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification
• Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly
• Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.
• Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.
• Drive mass production readiness with multiple engineering and operation teams

BASIC QUALIFICATIONS:

• 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.
• Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates
• Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)
• Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)
• Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.
• Understanding of CMOS image sensor sensor architecture and operation is preferred

BONUS QUALIFICATIONS:

• Bachelor's and/or Master's degree in Electrical or Mechanical Engineering
• Experience with optical systems
• Experience with ATE package test environment
• Experience with statistical analysis for volume production processes
• AEC-Q100 or related automotive qualification experience